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The Apple M4 processor inside the new iPad Pro is quite powerful and needs adequate cooling . The company made the Apple logo behind the tablet a heatsink.
One of the most interesting elements that Apple showed during the presentation of the iPad Pro was the processor cooling system. The Apple logo has become its passive part. The new iPad Pros have faster performance and better thermal management than previous models. This is due in part to two new technologies that improve heat dissipation.
First, Apple added graphite sheets to the body of the new iPad Pro. Secondly, the Apple logo itself, located on the back of the iPad Pro, is now part of the cooling design. The logo is made of copper and acts as a heatsink that helps conduct and dissipate heat from the M4 chip and other internal components.
Apple says the new iPad Pros offer 20% better cooling, but won't reveal how much that new copper logo contributes to those benefits. This is a pretty creative way to add functionality to the iconic Apple logo. But what we really need to study is how much the logo actually helps in dissipating heat. This could be either an effective technology or a marketing ploy to make the iPad Pro seem more technologically advanced.
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