Samsung changes the name of the 3nm process (SF3) to 2nm (SF2) to better compete with Intel 20A

by alex

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Samsung меняет название 3-нм техпроцесса (SF3) на 2-нм (SF2), чтобы лучше конкурировать с Intel 20A

Against the backdrop of increasing competition with Intel, Samsung Foundry decided to rebrand its technology second generation 3nm class production, formerly known as SF3. The future node has been renamed SF2 to denote a 2nm class manufacturing process. Informed sources report this. However, Samsung Foundry has not yet officially confirmed this renaming.

The source claims that last year Samsung Electronics signed a contract with Samsung Foundry for 3nm production of the 2nd generation. But the contract was subsequently revised to reflect changes in the process name. These changes seem to have happened at the beginning of this year.

It is noted that the renaming is part of Samsung's plans to simplify the nomenclature of processes. But it will also likely help the South Korean giant better compete with Intel Foundry, whose 2nm fabrication node, called Intel 20A, is expected to arrive later this year.

Samsung announced its technology roadmap back in 2022, listing a number of nodes that will be deployed through 2027. According to the roadmap, it will target mass production of 2nm process technology (SF2P) by 2025 and 1.4nm (SF1.4) by 2027. The company also said it plans to increase its production capacity for advanced nodes by more than 3 times by 2027.

However, earlier this year, Samsung notified its customers of changes to its roadmap and renaming the SF3 process to SF2. There is currently no information on whether there are any real changes to the architecture of the new node, other than a rebranding. That is, customers will most likely receive the same technology that was offered by the previous SF3 node.

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Samsung is expected to release its new SF2 process in the second half of this year. From what is known now, the SF2 uses Gate-all-around (GAA) or Multi-Bridge-Channel Field Effect Transistors (MBCFETs), but does not have back-side chip power supply (BSPDN) technology, unlike the Intel 20A. BSPDN appears to improve transistor performance, reduce power consumption, increase logic transistor density, and eliminate interference between the data and power circuits, potentially giving the Intel 20A a significant advantage. Samsung is still developing such technology.

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Samsung меняет название 3-нм техпроцесса (SF3) на 2-нм (SF2), чтобы лучше конкурировать с Intel 20A

Samsung меняет название 3-нм техпроцесса (SF3) на 2-нм (SF2), чтобы лучше конкурировать с Intel 20A

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