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Qualcomm has created a new pre-top-level processor. The Snapdragon 8s Gen 3 chip offers flagship features, but its performance is slightly lower than the Snapdragon 8 Gen 3. It is expected to create more affordable versions of flagship smartphones.
The Qualcomm Snapdragon 8s Gen 3 processor is manufactured using a 4nm process technology. It has a configuration of computing cores 1+4+3:
- 1 core Prime ARM Cortex X4 with a frequency of 3.0 GHz;
- 4 high-performance Cortex-A720 cores with a frequency of 2.8 GHz;
- 3 energy-efficient Cortex-A520 cores with a frequency of 2.0 GHz.
For comparison, the standard version of Snapdragon 8 Gen 3 has a 1+5+2 configuration (more powerful cores) and higher frequencies for all core blocks.
Another difference is the use of the previous generation X70 5G modem. In addition, the new product is slightly limited in memory speed. At the same time, the chip supports Wi-Fi 7, hardware accelerated ray tracing and has a Hexagon NPU. The device can run large language models with up to 10 billion parameters, meaning it will support models like the Gemini Nano along with artificial intelligence assistants. However, it lacks some of the AI features found in the 8 Gen 3 chip.
With the launch of Snapdragon 8s Gen 3, Qualcomm is adding another sub-category to its lineup. We suggest you familiarize yourself with the differences between the new product and the flagship processor in the following table.
| SoC | Snapdragon 8 Gen 3 (SM8650) |
Snapdragon 8s Gen 3 (SM8635) |
Snapdragon 8 Gen 2 (SM8550) |
| CPU | 1x Cortex-X4 @ 3.3GHz3x Cortex-A720 @ 3.2GHz2x Cortex-A720 @ 3.0GHz2x Cortex-A520 @ 2.3GHz 12MB sL3 |
1x Cortex-X4 @ 3.0GHz4xCortex-A720 @ 2.8GHz 3x Cortex-A520 |
1x Cortex-X3 @ 3.2GHz2xCortex-A715 @ 2.8GHz 2x Cortex-A710 4x Cortex-A510 8MB sL3 |
| GPU | Adreno (Hardware RT & Global Illum.) |
Adreno (Hardware RT) |
Adreno (Hardware RT) |
| DSP/NPU | Hexagon | Hexagon | Hexagon |
| Memory Controller |
4x 16-bit CH @ 4800MHz LPDDR5X/76.8GB/s |
4x 16-bit CH @ 4200MHz LPDDR5X/67.2GB/s |
4x 16-bit CH @ 4200MHz LPDDR5X/67.2GB/s |
| ISP/Camera |
Triple 18-bit Spectra ISP 1x 200MP or 108MP with ZSL 8K HDR video & 64MP burst capture |
Triple 18-bit Spectra ISP 1x 200MP or 108MP with ZSL 4K HDR video & 64MP burst capture |
Triple 18-bit Spectra ISP 1x 200MP or 108MP with ZSL 8K HDR video & 64MP burst capture |
| Encode/ Decode |
8K30/4K120 10-bit H.265 H.265, VP9, AV1 Decoding Dolby Vision, HDR10+, HDR10, HLG 720p960 SlowMo |
4K60 10-bit H.265 H.265, VP9, AV1 Decoding Dolby Vision, HDR10+, HDR10, HLG 1080p240 SlowMo |
8K30/4K120 10-bit H.265 H.265, VP9, AV1 Decoding Dolby Vision, HDR10+, HDR10, HLG 720p960 SlowMo |
| Integrated Radio |
FastConnect 7800 Wi-FI 7 + BT 5.4 2×2 MIMO |
FastConnect 7800 Wi-FI 7 + BT 5.4 2×2 MIMO |
FastConnect 7800 Wi-FI 7 + BT 5.3 2×2 MIMO |
| Integrated Modem | X75 integrated 3GPP Rel 18(5G NR Sub-6 + mmWave) DL = 10000 Mbps UL = 3500 Mbps |
X70 integrated 3GPP Rel 17(5G NR Sub-6 + mmWave) DL = 5000 Mbps UL = 3500 Mbps |
X70 integrated 3GPP Rel 17(5G NR Sub-6 + mmWave) DL = 10000 Mbps UL = 3500 Mbps |
| Mfc. Process | TSMC 4nm | TSMC 4nm | TSMC 4nm |
The new processor is expected to appear in Honor, iQOO, Realme, Redmi and Xiaomi smartphones, which will be announced later this month. According to rumors, Redmi Note 13 Turbo and Poco F6 will be among the first smartphones on Snapdragon 8s Gen 3.
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