For 20 million dollars
Raytheon, which is the main US defense contractor, has signed a contract with AMD to create multi-chip packaging.
The $20 million contract involves the development of next-generation multi-chip packaging for use in land, sea and airborne sensors. In this case, we are talking about military use, although, of course, there are no details on this matter.
As stated in the press release, this multi-chip package will be built using the latest chiplet interconnection standards, allowing individual chiplets to achieve peak performance and realize new system capabilities in a cost-effective and high-performance manner.
Chiplets from Raytheon partners will be integrated into an intercoupler designed and manufactured by Raytheon itself using the 3D Universal Packaging process.
Thus, it turns out that AMD will develop packaging for Raytheon that allows chiplets to be formed from several chiplets on one substrate, and the chiplets can be produced by different companies and perform different tasks.